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Field of Industry Structure Transformation

Next-generation Digital Infrastructure Construction

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Budget and 2050 Target Outcomes

Budget: Up to190.12B¥

CO₂Reduction Effect: 8,919.0Mt/yr

Economic Effect: Approx.358.0T¥

Related Contents

Special Feature Envisioning a Carbon-Neutral Society at Expo 2025 Osaka, Kansai – Part 3<br />Power Generation and Data Centers

Project Implementing Entities

[Research and Development 1]
Development of technology for manufacturing next-generation power semiconductor devices

Theme	Entity
Development of 8-inch next-generation SiC MOSFET	ROHM Co., Ltd.
Development of SiC modules for next-generation high-voltage power converters	ManagerToshiba Electronic Devices & Storage Corporation
	Toshiba Energy Systems & Solutions Corporation
Development of technology for manufacturing next-generation power semiconductor devices (for electric vehicle)	DENSO CORPORATION
Development of GaN power devices for next-generation high-power density industrial power supplies (servers, telecom, FA, etc.)	Toshiba Electronic Devices & Storage Corporation

[Research and Development 2]
Development of wafer technology for next-generation power semiconductors

Theme	Entity
Development of ultra-high quality and low-cost 8-inch SiC wafers	ManagerOXIDE Power Crystal Corporation
	Mipox Corporation
Development of manufacturing technology for high-quality 8-inch SiC single crystals/wafers	Central Glass Co., Ltd.
Development of SiC wafer technology for next-generation green power semiconductors	Resonac Corporation

[Research and Development 3]
Development of next-generation green data center technology

Theme	Entity
・Development of optoelectronic technology (development of photonics-electronics convergence devices and optical smart NICs) 1 ・Development of high-performance and energy-saving technology for chips and other components compatible with optical interface(development of power-saving CPUs, power-saving accelerators, and broadband SSDs) ・Development of disaggregation technology 1 NIC : Network Interface Card	ManagerFujitsu Limited
	1FINITY Inc.
	AIO Core Co., Ltd.
	Furukawa FITEL Optical Components Co., Ltd.
	KYOCERA Corporation
	NEC Corporation
	Kioxia Corporation
Development of high-performance and energy-saving technology for chips, etc. compatible with optical interface (development of nonvolatile memory)	Zeon Corporation

[Research and Development 4]
Construction of an IoT sensing platform

Theme	Entity
・Development of edge signal processing ・Development of SDK and platform ・Development of hardware board ・Development of application	Sony Semiconductor Solutions Corporation