noteProject Implementing Entities
[Research and Development 1]
Development of technology for manufacturing next-generation power semiconductor devices
| Theme | Entity |
|---|---|
| Development of 8-inch next-generation SiC MOSFET |
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| Development of SiC modules for next-generation high-voltage power converters |
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| Development of technology for manufacturing next-generation power semiconductor devices (for electric vehicle) |
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| Development of GaN power devices for next-generation high-power density industrial power supplies (servers, telecom, FA, etc.) |
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[Research and Development 2]
Development of wafer technology for next-generation power semiconductors
| Theme | Entity |
|---|---|
| Development of ultra-high quality and low-cost 8-inch SiC wafers |
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| Development of manufacturing technology for high-quality 8-inch SiC single crystals/wafers |
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| Development of SiC wafer technology for next-generation green power semiconductors |
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[Research and Development 3]
Development of next-generation green data center technology
| Theme | Entity |
|---|---|
| ・Development of optoelectronic technology (development of photonics-electronics convergence devices and optical smart NICs) *1 ・Development of high-performance and energy-saving technology for chips and other components compatible with optical interface(development of power-saving CPUs, power-saving accelerators, and broadband SSDs) ・Development of disaggregation technology *1 NIC : Network Interface Card |
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| Development of high-performance and energy-saving technology for chips, etc. compatible with optical interface (development of nonvolatile memory) |
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