Next-generation Digital Infrastructure Construction

Next-generation Digital Infrastructure Construction

Project Implementing Entities

[Research and Development 1]
Development of technology for manufacturing next-generation power semiconductor devices

ThemeEntity
Development of 8-inch next-generation SiC MOSFET
  • ROHM Co., Ltd.
Development of SiC modules for next-generation high-voltage power converters
  • ManagerToshiba Electronic Devices & Storage Corporation
  • Toshiba Energy Systems & Solutions Corporation
Development of technology for manufacturing next-generation power semiconductor devices (for electric vehicle)
  • DENSO CORPORATION
Development of GaN power devices for next-generation high-power density industrial power supplies (servers, telecom, FA, etc.)
  • Toshiba Electronic Devices & Storage Corporation

[Research and Development 2]
Development of wafer technology for next-generation power semiconductors

ThemeEntity
Development of ultra-high quality and low-cost 8-inch SiC wafers
  • ManagerOXIDE Corporation
  • Mipox Corporation
Development of manufacturing technology for high-quality 8-inch SiC single crystals/wafers
  • Central Glass Co., Ltd.
Development of SiC wafer technology for next-generation green power semiconductors
  • Resonac Corporation

[Research and Development 3]
Development of next-generation green data center technology

ThemeEntity
・Development of optoelectronic technology (development of photonics-electronics convergence devices and optical smart NICs) *1
・Development of high-performance and energy-saving technology for chips and other components compatible with optical interface(development of power-saving CPUs, power-saving accelerators, and broadband SSDs)
・Development of disaggregation technology
*1 NIC : Network Interface Card
  • ManagerFujitsu Limited
  • AIO Core Co., Ltd.
  • Fujitsu Optical Components Limited
  • KYOCERA Corporation
  • NEC Corporation
  • Kioxia Corporation
Development of high-performance and energy-saving technology for chips, etc. compatible with optical interface (development of nonvolatile memory)
  • Zeon Corporation

[Research and Development 4]
Construction of an IoT sensing platform

ThemeEntity
・Development of edge signal processing
・Development of SDK and platform
・Development of hardware board
・Development of application
  • Sony Semiconductor Solutions Corporation